Integration of a high density Ta₂O₅ MIM capacitor following 3D damascene architecture compatible with copper interconnectsTHOMAS, M; FARCY, A; DELOFFRE, E et al.Microelectronic engineering. 2006, Vol 83, Num 11-12, pp 2163-2168, issn 0167-9317, 6 p.Conference Paper

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High-resolution computer tomography of the airways : HRCT of the lungs: state of the art. IGRENIER, P; CORDEAU, M.-P; BEIGELMAN, C et al.Journal of thoracic imaging. 1993, Vol 8, Num 3, pp 213-229, issn 0883-5993Article

Anterior mediastinal mass in a patient with prior saphenous vein coronary artery bypass graftingTROP, I; SAMSON, L; CORDEAU, M.-P et al.Chest. 1999, Vol 115, Num 2, pp 572-576, issn 0012-3692Article

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